TTTC's Electronic Broadcasting Service

INTERNATIONAL TEST CONFERENCE 2005
"Test: Survival of the Fittest"
Austin Convention Center, Austin, TX, USA

November 8 - November 10, 2005
(Test Week™ is November 6 - 11, 2005)

http://www.itctestweek.org

CALL FOR PAPERS
Lecture Series and Application Series
Overview -- Submissions -- Contacts

Overview

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International Test Conference is the world's premier conference dedicated to the electronic test of devices, boards and systems -- covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.

This year, ITC will focus on evolutionary as well as revolutionary trends in test technology. Evolving new "out-of-the-box" ideas to meet the tough test challenges presented by very-deep-submicron technologies and the competition for dominance among alternative solutions. Recent advances in areas such as on-chip compression, low-cost test, and test data analysis have burst onto the scene and are being rapidly and widely adopted.

Submissions for the Lecture Series should emphasize topics are new and at the leading edge of technology—currently topical or heavily debated topics that are important to the testing industry. The purpose of the Application Series is to cover test application topics using an embedded tutorial format. The topics presented should be based on experience and should provide a practical coverage of the topic. Participation is encouraged from individuals who have a practical knowledge of the topic based on experience.

Possible Lecture and Application Series Topic Areas:

  • BIST or Embedded Test for Chip and Board
  • Board and System Test
  • Loadboard Design and Tester Interfacing
  • Simulation and Test
  • Design-for-Test: Chip, Board and System
  • Design-for-Reliability
  • Design-for-Yield
  • Experiments and Case Studies
  • High-Speed Digital Test
  • RF Test
  • Statistical Methods in Test
  • System-on-Chip Test
  • System-in-Package Test
  • Test Methodologies
  • Test Resource Partitioning

Submissions

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Lecture and Application Series sessions are 90 minutes long. The format is flexible and can consist of from one to three paper presentations. Papers will be reviewed and included in the ITC Proceedings. Lecture and Application Series submissions may cover a single paper or an entire session.

Simply register as an ITC author on the Test Week Web site, http://www.itctestweek.org, and submit your proposal there.

Submissions must include:

  • Title of paper or session.
  • Name, affiliation, mailing address, e-mail address, telephone and fax number of each author.
  • Designation of the presenter(s). ITC will communicate with the presenter(s).
  • An electronic copy of a one- or two-page extended summary of the proposed paper or session.

Please note that the submission deadline is firm.

Submission Deadline: February 18, 2005

Organizer Notification: May 15, 2005

Manuscript Deadline: July 15, 2005

All submissions and presentations must be in electronic format. Prospective authors must read the detailed instructions regarding formats and submission requirements that are available on the ITC Web page at: http://www.itctestweek.org

Contacts

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For further information, check the ITC Web page or contact:

International Test Conference
Washington, D.C., USA
Tel: +1 202.973.8665 Fax: +1 202.331.0111
E-mail: itc@courtesyassoc.com

Program Chair:
Ken Butler, Texas Instruments
E-mail: kenb@ti.com

Lecture and Application Series Coordinator:
Craig Soldat, Agilent Technologies
E-mail: craig_soldat@agilent.com

For more information, visit us on the web at: http://www.itctestweek.org/

INTERNATIONAL TEST CONFERENCE 2005 is sponsored by the IEEE Computer Society and the Institute of Electrical and Electronic Engineers.


IEEE Computer Society - Test Technology Technical Council

TTTC CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

SENIOR PAST CHAIR
Yervant ZORIAN
Virage Logic - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com


TTTC 2ND VICE CHAIR
Michel RENOVELL
LIRMM - France
Tel. +33 467 418 523
E-mail renovell@lirmm.fr

FINANCE CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

IEEE DESIGN & TEST EIC
Rajesh K. GUPTA
University of California, Irvine - USA
Tel. +1-949-824-8052
E-mail gupta@uci.edu

TECHNICAL MEETINGS
Cheng-Wen WU

National Tsing Hua Univ. - Taiwan
Tel. +886-3-573-1154
E-mail cww@computer.org

TECHNICAL ACTIVITIES
Michel RENOVELL
LIRMM - France
Tel. +33 467 418 523
E-mail renovell@lirmm.fr

ASIA & SOUTH PACIFIC
Hideo FUJIWARA
Nara Inst. of Science and Technology - Japan
Tel. +81-74-372-5220
E-mail fujiwara@is.aist-nara.ac.jp

LATIN AMERICA
Marcelo LUBASZEWSKI
Federal Univ. of Rio Grande do Sul (UFRGS) - Brazil
Tel. +34-93-401-6603
E-mail luba@vortex.ufrgs.br

NORTH AMERICA
William R. MANN
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic, Inc. - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

 

PAST CHAIR
Paolo PRINETTO
Politecnico di Torino - Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 1ST VICE CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

ITC GENERAL CHAIR
Donald WHEATER
IBM - USA
Tel. +1-802-769-7261
E-mail dwheater@us.ibm.com

TEST WEEK COORDINATOR
Yervant ZORIAN
Virage Logic, Inc. - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

Univ. of Piraeus - Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Joan FIGUERAS
Univ. Politècnica de Catalunya - Spain
Tel. +55-51-228-1633, Ext. 4830
E-mail figueras@eel.upc.es

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
Michael NICOLAIDIS
iRoC Technologies - Greece
Tel. +33-4-381-20763
E-mail michael.nicolaidis@iroctech.com

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it


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